Rendition V2100 Chip Details
| Main Chip Details | |
|---|---|
| Manufacturer | Rendition |
| Process | 350nm |
| Foundry | |
| Transistor Count | M |
| Die Size | 0mm² mm x mm |
| Chip Package | Wirebond |
| Memory Bus | |
|---|---|
| Bus Width | 64-bit |
| Memory Channels | 1 x 64-bit |
| Memory Type Support | SDR/SGR |
| Geometry Pipeline | |
|---|---|
| Geometry Processing | |
| Processor Configuration | |
| Rasteriser | |
|---|---|
| Basic Pipeline Config |
1 / 1 / 1 Textures / Pixels / Z |
| Textures Per Pass | 1 |
| Basis Filtering | Bilinear |
| Texture Filtering Methods | Perspective correction, Bilinear |
| Texture Compression | |
| Fragment Processing | |
| Fragment Processing Precision | 16/24-bit |
| Fragment Processors | |
| FSAA | |
|---|---|
| FSAA Support | |
| ROP Subsamples | |
| Subsampling Method | |
| Further Details | |
|---|---|
| API Compliance | DX5.0 |
| System Interconnect | PCI |
| Display Pipeline | 170MHz RAMDAC |
| Multi GPU Support | |