S3 S4 Chip Details
| Main Chip Details | |
|---|---|
| Manufacturer | S3 |
| Process | 130nm |
| Foundry | TSMC |
| Transistor Count | 40M |
| Die Size | 0mm² mm x mm |
| Chip Package | Wirebond |
| Memory Bus | |
|---|---|
| Bus Width | 128-bit |
| Memory Channels | 2 x 64-bit |
| Memory Type Support | DDR |
| Geometry Pipeline | |
|---|---|
| Geometry Processing | VS2.0 |
| Processor Configuration | 2 VS |
| Rasteriser | |
|---|---|
| Basic Pipeline Config |
4 / 4 / 4 Textures / Pixels / Z |
| Textures Per Pass | 16 |
| Basis Filtering | Bilinear |
| Texture Filtering Methods | Bilinear, Trilinear, 1-16x Anisotropic Filtering |
| Texture Compression | S3TC/DXTC |
| Fragment Processing | PS2.0 |
| Fragment Processing Precision | FP24 |
| Fragment Processors | 1 Vec4 Per Pipeline |
| FSAA | |
|---|---|
| FSAA Support | 2X Super-Sampling |
| ROP Subsamples | 1 |
| Subsampling Method | |
| Further Details | |
|---|---|
| API Compliance | DX9.0 |
| System Interconnect | |
| Display Pipeline | |
| Multi GPU Support | |